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Flexible Electronics Technology

Department of Industrial Engineering via Mesiano 77, Trento - Room S3

November 29th, 2013
3:30 – 4:30 pm

University of Trento - Department of Industrial Engineering
Chemistry & Ceramics Laboratory
Seminars on “Advanced Materials”

  • Ravinder S. DAHIYA, Electronics and Nanoscale Engineering, School of Engineering, University of Glasgow, G12 8QQ, UK


The birth of microelectronics and subsequent miniaturization strategies have revolutionized computing and communications. Yet, as revolutionary as it has been, in its current form, it cannot address issues like realizing sensitive electronic systems on unconventional substrates such as plastics or paper that can be wrapped around curved surfaces such as on the body of robots or on artificial limbs. Early attempts to achieve conformable electronic systems primarily followed the flexible printed circuit boards (PCB) route. The PCB approach, albeit worthy, offers a limited degree of mechanical flexibility. Recent efforts to address these challenges include fabricating sensing and electronic components directly on the flexible substrates or on thin silicon wafers. A variety of solutions, ranging from TFTs to printed electronics have appeared using a wide variety of materials, including organic and inorganic semiconductors. Ultra-thin bendable chip is another interesting route complementing the recently explored micro-/nano-wires approach. The advent of fully flexible electronic systems will be a great leap in technology, as it will open the door to the next-generation electronic environment based on bendable and wearable devices. This lecture will present these developments with a focus on the strategies for obtaining high-performance bendable electronics.

Ravinder S. Dahiya - Short CV

Ravinder Dahiya is Senior Lecturer with Electronics and Nanoscale Engineering, University of Glasgow, U.K. He received B.Tech (honors) in Electrical Engg. from Kurukshetra Univ. (India), M.Tech. (Electrical Engg.) from Indian Institute of Technology Delhi (India), and Ph.D. from Italian Institute of Technology, Genoa (Italy), and Univ. of Genoa (Italy). In past, he has worked NSIT Delhi (India), Italian Institute of Technology, Genoa (Italy), Fondazione Bruno Kessler, Trento (Italy), and Univ. of Cambridge (U.K.).

His current multidisciplinary research interests include Flexible Electronics, Electronic Skin, Tactile Sensing Systems, Smart Materials, Microsystems, and Robotics. He has published more than 80 research articles, holds a patent, and authored the book Robotic Tactile Sensing – Technologies and System, published by Springer. He has worked on the many international projects (ROBOSKIN, RobotCub, Flexsensotronics) and currently leading a European Commission funded Initial Training Network, CONTEST, in the area of flexible electronics.

He is senior member of IEEE. Currently, he is on Editorial Boards of IEEE Transactions on Robotics and IEEE Sensors Journal. He was Guest Editor of IEEE Sensors Journal Special Issue on ‘Flexible Sensors and Sensing Systems’ (published in Oct 2013) and IEEE Transactions on Robotics Special Issue on Robotic Sense of Touch (published in June 2011). He is member of IEEE Sensors Council AdCom (Administrative Committee), as representative of IEEE Robotics and Automation Society.

Ravinder was awarded with the University Gold Medal for securing